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Wafer Probers
300 mm
EG6000
EG6000e
200 mm
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Learn more about the EG6000e:

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Fine-pitch probing for Parametric Test Structures

The demands of 300mm production require highly accurate parametric testing at increasingly lower current and voltage levels. The EG6000e is designed to answer this challenge, offering exceptional low electrical noise and fast settling for high-throughput measurements.

EG6000e Key Benefits

  • Extremely low system noise, electrical leakage and capacitance
  • Precision direct-drive technology to attain the industry's highest
    300mm probing accuracy
  • Increased throughput with fast electrical settling
  • Active control of external vibration for consistent test results
  • Safe and accurate testing of sensitive Cu and low K dielectric devices
  • The ability to quickly test at different temperatures