Fast probing for high throughput of small die

For many chipmakers engaged in 200mm wafer production, throughput is the single most important factor with regard to wafer probing. The Horizon 4090µ+ Fast Probe is designed to meet the need for speed, delivering the shortest 200 mm wafer probing stepping times available.

4090µ+ Fast Probe Key Benefits:

• Increased manufacturing throughput and productivity.
• Reduced cost-of-ownership for applications that require short test times or testing of large numbers of die per wafer.
• 40-50 percent gain in system throughput and manufacturing for low-cost, commodity-type devices.