To ensure device quality, chipmakers need the ability to accurately test known-good die, wafer-level packages and microelectromechanical systems (MEMS) after dicing. Pathfinder is an advanced, fully automatic wafer, die and package test-handling system that enables chipmakers to maximize efficiency, yield and profit.

Pathfinder Key Benefits:

• Leverages Electroglas' production-proven prober technology to bring a new level of automation to the die and package test arena.
• Unique non-linear alignment techniques that deliver unparalleled accuracy, even for multi-die testing applications.
• Safe testing of ultra-thin wafers and other fragile substrates without risk of breakage or micro-cracking.
• The ability to test multiple, singulated and non-singulated package strips, saving valuable test time during ball grid array (BGA), micro ball grid array (MBGA) and chip scale packages (CSP) production.
• Accurate testing of package device strips or panels mounted on film in industry-standard film frames.