Electroglas: Package Test Handlers

Built on prober technology

Electroglas test handlers are built upon proven prober technology to provide the lowest cost of test for nearly all packaging types, including wafer level packages (WLP), known-good die (KGD), microelectromechanical systems (MEMS), ultra-thin and/or diced wafers, as well as any packages in strip, panel or lead frame format.

Electroglas Automated Test Handlers Key Benefits:

Greater handling speed and accuracy from what's possible with traditional handling methodologies
Simplified final test process
Maximized profitability by increasing test cell throughput
Handles the tightest geometries of new packages

Learn more:

Pathfinder - Dicing Frame Test Handler
- Diced wafers
- Ultra-thin wafers
- Known-Good Die (KGD) post dicing
- Wafer-Level Chip Scale Packages (WLCSP)
- Strips mounted to dicing film