2005  2004  2003  2002  2001  2000

2005

• Assembly Concerns for Test in Strip, by Bob Fenton, Electroglas, Inc.
• COMPOTECH Interview
• SEMICON Europa 2005, Using Process Step Verification (PSV) to Ensure Wafers Have Completed All Process Steps (Paper), by Jeffrey C. Quinton of Delphi Electronics & Safety, and FB Lynch, III of Electroglas, Inc.
• SEMICON Singapore 2005, Using Process Step Verification (PSV) to Ensure Wafers Have Completed All Process Steps (Presentation), by Jeffrey C. Quinton of Delphi Electronics & Safety, and FB Lynch, III of Electroglas, Inc.
• Wafer Probe Acquires a New Importance in Testing, by Mark Allison, Electroglas, Inc.

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2004

• Semiconductor International, 2004 Forecast: CEO Roundup, Keith Barnes, Electroglas, Inc., contributor (January on-line edition)
• Semiconductor International, The Changing Face of Equipment Sales, by Pat Kiely, Electroglas, Inc., contributor to "Memories of 25 Years Gone By" (January)

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2003

• Advanced Packaging, Strip Testing: Uniformity in Final Package Test, by Bob Fenton, Electroglas, Inc. (November)
• Chip Scale Review, Wafer Probing Is a Critical Technology for the Semiconductor Manufacturing Test Floor, by Karl R. Heiman, Chuck Heebner, and Chris Taylor, Electroglas Inc. (January/February)
• Semiconductor International, Movers and Shakers, interview with Curt Wozniak, Chairman and CEO, Electroglas, Inc., (January)
• Semiconductor International, 2003 Economic Forecast: CEO Roundup, contributed viewpoint from Curt Wozniak, Chairman and CEO, Electroglas, Inc., (January)

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2002

• Semiconductor Business News, "Electroglas' LaChapelle addresses booming semi software market", interview with Joe LaChapelle, VP and General Manager, EGsoft (September 25, 2002)
• European Semiconductor, "Cost-of-ownership As A Real-time Control Metric", Howard Ignatius, Electroglas, and Darren Dance, Wright Williams & Kelly (September)
• Solid State Technology, "Beyond Overall Equipment Efficiency: What's Your Overall Fab Efficiency?" by Tom Simas (July)
• Semiconductor International, "Front-End Trends: Exhibitor Outlook Roundup" contributed viewpoint from Joe LaChapelle, Electroglas, Inc. (July)
• The Wallstreet Reporter, Hear Interview With Electroglas' CEO, Curt Wozniak (July 2, 2002)
• Solid State Technology, "Meeting 2001 ITRS Challenges" by Editorial Staff, with contributions from Joseph LaChapelle, Electroglas, Inc. (May)

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2001

• Semiconductor International, "The E-Manufacturing Domino Effect" by Howard Ignatius and Tom Simas, (July)
• European Semiconductor, "Highway to the e-Fab" by Harvey Wohlwend of SEMATECH and Howard Ignatius, Electroglas, Inc.(May)
• Electronic Design, "Software Squeezes the Most from IC Wire-Bond Designs", (May)
• The Wall Street Transcript, CEO/Company Interview with Curt Wozniak, (March)
• Semiconductor International, "E-Manufacturing is Imminent" by Editorial Staff, with contributions from Jeff Hintzke, Electroglas, Inc. (March)  
• Semiconductor FPD World (Japan), "A Yield-Management System for LCD Fabrication" by Samuel Tam (March)
• HDI, "Provisions for Testing Die on Ultrathin Wafers" by Jeff Hintzke (March)  [Summary of article] 
• Solid State Technology, "e-Diagnostics is Merely an Aspect of e-Manufacturing" by Editorial Staff, with contributions from Howard Ignatius, Electroglas, Inc. (March) 

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2000

• Information Display, "Automated Yield-Management Software in LCD Production" by Ankush Oberai and Samuel Tam (November)
• Chip Scale Review, "Complex Devices, Tighter Bump Pitches Require 100% Inspection" by Cary Kiest, Electroglas, Inc. (November) 
• Semiconductor International, "Inspecting Bumped Wafers:  What You Should Know" by Bernie Adams, Electroglas, Inc. (October)
• Investor's Business Daily, "Q&A Curtis Wozniak", Interview with Electroglas' CEO (August)
• Semiconductor Fabtech, "Automated Yield Management Software in LCD Production" by Ankush Oberai and Samuel Tam (July, 12th edition)  [Article Summary] 
• TAPtechnology, "Bumped Wafer Inspection" by Cary Kiest (July, launch edition) [Summary of article] 
• Semiconductor International Web Exclusive, "A New Diagnostic Methodology:  An IBM Beta Test Case" by Gary Maier of IBM and Shawn Smith of Electroglas, Inc. (March) 
• Asian Sources Electronics Engineer (web edition), "Device Innovation Will Astound Our Wildest Optimists" by Curt Wozniak (January)
• TAPtechnology, "Provisions for Testing Die on Ultra Thin Wafers" by Jeff Hintzke, Electroglas, Inc. (Winter, 2nd edition)

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