For more than 40 years, semiconductor companies have turned to Electroglas for technology to meet the industry's evolving manufacturing needs. Founded in 1960 as Specialty Products, a producer of glass capillaries, the company quickly adapted its focus to meet the emerging need for wafer probing technology, adopting the name Electroglas.

Since then, a fierce commitment to research and development has established Electroglas as a leading provider of automated probing technologies, with more than 15,000 systems shipped. The company's dedication to improving customer test efficiency has also resulted in the delivery of visionary prober-based solutions for both sort floor and final test applications.

A History of Innovation

2009 - Acquired by EG Systems LLC.

2005 - Introduction of the EG6000, the fastest, most accurate and reliable prober on the market. The EG6000, Electroglas’ second generation 300mm prober, fuses the automation and reliability requirements of high-volume manufacturing environments with the highest caliber of prober technology. The EG6000e, a fully automatic 300mm parametric wafer prober is designed for high throughput, low noise measurements. The EG6000e is introduced to combine automation features, throughput and reliability of a high volume manufacturing tool with industry leading, low noise chuck technology.

2004 - The 4090µ+, >a new extended performance wafer prober system for 200 mm wafers, is introduced to address the demands of testing fine pitch devices, semiconductors with copper interconnects and low-k dielectric processes, and other advanced applications. Advanced Packaging names Electroglas' Sidewinder strip test handler the Best New Product for Handling Equipment. introduction of the 4090 Micro Plus, a new extended performance wafer prober system for 200 mm wafers.

2003 - Sidewinder becomes Electroglas' second prober-based final test handling solution, delivering superior throughput and accuracy for the handling of packaged semiconductor and discrete components in panel or lead frame format.

2002 - Electroglas extends its prober technology into the final test arena, delivering Pathfinder - an advanced, fully automatic wafer, die and package test-handling system. The new system allows chipmakers to accurately test known-good die, wafer-level packages, and microelectromechanical systems (MEMS) after dicing.

2001 - Electroglas launches the EG5|300 ARGOS, the first 300mm wafer prober capable of ± 1.0micron stepping accuracy. At the same time, the Horizon 4090µ Fast Probe is introduced, delivering up to 40% faster stepping times to increase overall system throughput for small die applications.

2000 - The Horizon 4090f is introduced, offering an automatic film-frame probing system for the testing of die and ultra-thin wafers. The EG5|300e, a high-throughput, automatic prober for parametric testing on 300mm wafers is also introduced.

1999 - The EG4|200 becomes the only prober capable of exerting the extremely high probe loads required for multiple die and bumped wafer testing. The EG5|300 launches Electroglas into the 300mm market with a new system architecture and advanced automation features for improved accuracy, throughput and reliability.

1996-1998 - Electroglas delivers the Horizon 4090, providing faster speeds, improved accuracy and broad compatibility with third-party equipment. The Horizon 4090µ, introduced in 1997, offers a comprehensive probing solution for ultra-clean parametric test environments.

1986-1992 - The 3001 becomes the world's first prober designed to handle 8-inch wafers, and the Horizon 4060 and 4080 are the first to use new, highly advanced Electroglas system software - EGCommander.

1982-1985 - Electroglas introduces the industry's first fully automated prober, the 2001. This product quickly became an industry standard. Electroglas also released the 2010 during this time, utilizing a robotic material handler for safe, efficient wafer processing.

1973 - The Electroglas 1034x becomes the first prober to employ a sawyer motor, enabling frictionless, high-speed wafer positioning.

1964 - Electroglas introduces the first commercial prober for testing semiconductor die (the EG 900), seven years before the introduction of the first microprocessor.